Method of manufacturing an integrated thermal printing head

Details Method of manufacturing an integrated thermal printing head Method of manufacturing an integrated thermal printing head

1978-05-31

1980-12-23

Smith, John D.

Coating processes

Electrical product produced

Resistor for current control

29611, 29620, 29621, 204192F, 219216, 219543, 4271262, H05B 100

Patent

active

042411033

ABSTRACT:
A thermal printing head having a heating resistor prepared according to a thin-film technique and a wiring circuit prepared according to a thick-film technique achieves a high printing quality at a low cost. A thin-film resistor is formed on a heat-insulating dielectric layer which is, in turn, provided partially on a dielectric substrate, while thick-film lead electrodes, which are connected to a driving circuit, are formed on the dielectric substrate so as to make contact with the edge portion of the heat-insulating dielectric layer. Thin-film lead electrodes electrically connect the thick-film lead electrodes to the opposite ends of the thin-film resistor. The heat-insulating dielectric layer and the thick-film lead electrodes are provided by means of thick-film technique such as screen-printing and succeeding firing processes and the thin-film resistor and the thin-film lead electrodes are formed through thin-film technique such as sputtering or vacuum-evaporating process.

REFERENCES:
patent: 3825722 (1974-07-01), Taniguchi
patent: 3903393 (1975-09-01), Wesley
patent: 4007352 (1976-02-01), Ura
patent: 4017712 (1977-04-01), Baraff
patent: 4031272 (1977-06-01), Khanna

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