Method of manufacturing an integrated photoelectric receiving de

Fishing – trapping – and vermin destroying

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437 23, 437 29, 437129, 437133, 257292, 257458, H01L 3118, H01L 21265, H01L 2120

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active

052428397

ABSTRACT:
The present invention relates to an integrated photoelectric receiving device in which a PIN-type photodetector and a junction field effect transistor (FET) are integrated in a single chip. The photoelectric receiving device comprises a photodetector having a n-channel layer, an etching stopper layer and an absorption layer formed on a semi-dielectric substrate, the n-channel layer, the etching stopper layer and the absorption layer being formed in a reverse mesa shape and the substrate being etched by a predetermined depth; a transistor having a n-channel layer, an etching stopper layer and a p-type InP layer sequentially formed on the non-etched portion of the semi-insulator substrate, the p-type InP layer having an absorption layer formed thereon in a reversedmesa shape. Also, the invention contemplates a method of manufacturing the device.

REFERENCES:
patent: 4719498 (1988-01-01), Wada et al.
patent: 4774205 (1988-09-01), Choi et al.
patent: 4879250 (1989-11-01), Chan
patent: 5021361 (1991-06-01), Kimoshita et al.
patent: 5051372 (1991-09-01), Sasaki

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