Method of manufacturing an integrated package having a pair of d

Details Method of manufacturing an integrated package having a pair of d Method of manufacturing an integrated package having a pair of d

1995-08-21

1997-04-01

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

257686, 26427211, H01R 4300

Patent

active

056154755

ABSTRACT:
This invention is for an integrated circuit package which includes two integrated circuit die connected to a common substantially planar lead frame, wherein bond pads on each die face the common lead frame.

REFERENCES:
patent: 3746934 (1973-07-01), Stein
patent: 4103318 (1978-07-01), Schwede
patent: 4288841 (1981-09-01), Gogal
patent: 4437235 (1984-03-01), McIver
patent: 4630172 (1986-12-01), Stenerson et al.
patent: 4680617 (1987-07-01), Ross
patent: 4763188 (1988-08-01), Johnson
patent: 4823234 (1989-04-01), Konishi et al.
patent: 4878106 (1989-10-01), Sachs
patent: 5012323 (1991-04-01), Farnworth
patent: 5016138 (1991-05-01), Woodman
patent: 5034350 (1991-07-01), Marchisi
patent: 5057906 (1991-10-01), Ishigami
patent: 5101324 (1992-03-01), Sato
patent: 5227995 (1993-07-01), Klink et al.
patent: 5250845 (1993-10-01), Runyan
patent: 5262927 (1993-11-01), Chia et al.
patent: 5279029 (1994-01-01), Burns
patent: 5347429 (1994-09-01), Kohno et al.
patent: 5359222 (1994-10-01), Okutomo et al.
patent: 5359225 (1994-10-01), Haley
patent: 5389817 (1995-02-01), Imamura et al.
patent: 5402006 (1995-03-01), O'Donley
"3D Interconnection For Ultra-Dense Multichip Modules," Abstract, Christian VAL, IEEE, pp. 540-547.

Affiliated with

Also associated with

Rating

Method of manufacturing an integrated package having a pair of d does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing an integrated package having a pair of d, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing an integrated package having a pair of d will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-530903