Method of manufacturing an integrated optical component comprisi

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

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385 50, 385129, 385130, H01L 2102, H01L 2120, H01L 213065, G02B 613, G02B 6136

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060402466

ABSTRACT:
To form an integrated optical component comprising a thick waveguide coupled to a thin waveguide, the method consists in:
depositing a first guiding layer of said thick waveguide on a substrate;
locally etching said first guiding layer over a portion allocated both to a coupling interface and to the thin waveguide;
depositing a second guiding layer on the first guiding layer and on the locally etched portion so as to form said thick waveguide in a manner such that it has a maximum thickness in a first zone, a graded-thickness section in a second zone, and a reduced-thickness section in a third zone;
locally etching the second guiding layer over a portion of the third zone, said portion being allocated to the thin waveguide; and
depositing a third guiding layer in said portion of said third zone so as to form said thin waveguide.

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