Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Patent
1998-09-08
2000-03-21
Utech, Benjamin
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
385 50, 385129, 385130, H01L 2102, H01L 2120, H01L 213065, G02B 613, G02B 6136
Patent
active
060402466
ABSTRACT:
To form an integrated optical component comprising a thick waveguide coupled to a thin waveguide, the method consists in:
depositing a first guiding layer of said thick waveguide on a substrate;
locally etching said first guiding layer over a portion allocated both to a coupling interface and to the thin waveguide;
depositing a second guiding layer on the first guiding layer and on the locally etched portion so as to form said thick waveguide in a manner such that it has a maximum thickness in a first zone, a graded-thickness section in a second zone, and a reduced-thickness section in a third zone;
locally etching the second guiding layer over a portion of the third zone, said portion being allocated to the thin waveguide; and
depositing a third guiding layer in said portion of said third zone so as to form said thin waveguide.
REFERENCES:
patent: 3948583 (1976-04-01), Tien
patent: 4820655 (1989-04-01), Noda et al.
patent: 5332690 (1994-07-01), Cho et al.
patent: 5379359 (1995-01-01), Gupta
patent: 5472907 (1995-12-01), Binsma et al.
patent: 5568579 (1996-10-01), Okaniwa
Patent Abstracts of Japan, vol. 097, No. 010, Oct. 31, 1997 corresponding to JP 09 152528 A (Sharp Corp) dated Jun. 10, 1997.
Patent Abstracts of Japan, vol. 095, No. 005, Jun. 30, 1995, corresponding to JP 07 043552 A (Hitachi Cable Ltd) Feb. 14, 1995.
Patent Abstracts of Japan, vol. 097, No. 006, Jun. 30, 1997, corresponding to JP 09 036487 A (Fujitsu Ltd), Feb. 7, 1997.
Patent Abstracts of Japan, vol. 006, No. 229 (P-155) Nov. 16, 1982 corresponding to JP 57 132105 A (Nippon Denki KK) Aug. 16, 1982.
Dagens Beatrice
Goldstein Leon
Leclerc Denis
Alcatel
Umez-Eronini Lynette T.
Utech Benjamin
LandOfFree
Method of manufacturing an integrated optical component comprisi does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing an integrated optical component comprisi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing an integrated optical component comprisi will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-730187