Method of manufacturing an integrated electro-optical package

Details Method of manufacturing an integrated electro-optical package Method of manufacturing an integrated electro-optical package

1997-07-08

1998-05-05

Whitehead, Carl W.

Semiconductor device manufacturing: process

Including control responsive to sensed condition

438 41, 438 45, 438163, H01L 2120

Patent

active

057473633

ABSTRACT:
An integrated electro-optical package including a plurality of organic light emitting devices (LEDs) directly interconnected to external driver circuits utilizing a printed circuit board, having formed therein a plurality of plated through-hole vias and a method of fabricating the integrated electro-optical package. The organic LEDs are fabricated on a supporting substrate and include vertical interconnections to driver and control circuits mounted on an uppermost surface of a printed circuit board (PCB). The vertical interconnections are formed utilizing plated through-hole conductive vias formed in the printed circuit board, conductive leads, and conductive epoxy. A hermetic seal is formed by positioning a sealing ring formed on the printed circuit board in sealing contact with a sealing area on the surface of the substrate so as to hermetically seal the organic light emitting devices.

REFERENCES:
patent: 5607876 (1997-03-01), Biegelsen et al.
patent: 5620905 (1997-04-01), Konuma et al.
patent: 5646064 (1997-07-01), Gaumont-Guarin et al.

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