Method of manufacturing an integrated circuit device

Details Method of manufacturing an integrated circuit device Method of manufacturing an integrated circuit device

1983-06-27

1984-09-04

Weisstuch, Aaron

Metal working

Method of mechanical manufacture

Assembling or joining

357 80, 357 54, 29583, 156630, 156632, H01L 2178, H01L 2195

Patent

active

044688571

ABSTRACT:
A method for manufacturing an integrated circuit device illustrates the preparation of the first surface of a circuit wafer including the placement of fine alignment indicia 34a outside the active chip area. A support wafer 50 is secured to the first surface of the circuit wafer 10 by an adhesive layer 58. The circuit wafer 10 is thinned. Openings 66 are photoshaped in the circuit wafer 10 using wafer flats 51 for alignment. The openings expose alignment indicia 34a which are relief images in the adhesive of the alignment pattern 34. The exposed surface of the circuit wafer 10 is photoshaped, using the indicia 34a for alignment, to define wafer segments 68 positioned over resistor doped regions 22.

REFERENCES:
patent: 3852563 (1974-12-01), Bohorquez et al.
patent: 3889358 (1975-06-01), Barhenke
patent: 3902936 (1975-09-01), Price
patent: 4110598 (1978-08-01), Small
patent: 4134125 (1979-01-01), Adams et al.
patent: 4266334 (1981-05-01), Edwards et al.

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