Method of manufacturing an imprinting template using a...

Details Method of manufacturing an imprinting template using a... Method of manufacturing an imprinting template using a...

2007-01-31

2010-12-07

Culbert, Roberts (Department: 1716)

Etching a substrate: processes

Masking of a substrate using material resistant to an etchant

C216S011000, C216S044000, C216S056000, C438S694000

Reexamination Certificate

active

07846345

ABSTRACT:
The method of manufacturing an imprinting template according to the present invention utilizes a semiconductor manufacturing process and comprises a step of etching an oxide layer having a thickness of from 1000 to 8000 angstroms on a substrate by a microlithography and etching process, to form a pattern having a plurality of pillar-shaped holes, thereby forming an imprinting plate having a plurality of pillar-shaped holes. A material layer may be filled into the holes and a part of the oxide layer is removed to form an imprinting template having a plurality of pillar-shaped protrusions. Alternatively, a silicon substrate may be used instead of the substrate and the oxide layer. The imprinting template according to the present invention has advantages of mass production, fast production, and low cost, and is suitable to serve as the imprinting plate for making photonic crystals.

REFERENCES:
patent: 5550085 (1996-08-01), Liu
patent: 5772905 (1998-06-01), Chou
patent: 6387787 (2002-05-01), Mancini et al.
patent: 2002/0115002 (2002-08-01), Bailey
patent: 2003/0205657 (2003-11-01), Voisin
patent: 2004/0023162 (2004-02-01), Hasegawa et al.
patent: P2006326724 (2006-12-01), None

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