Method of manufacturing an IC package

Details Method of manufacturing an IC package Method of manufacturing an IC package

2006-01-17

2006-01-17

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S841000, C029S855000, C257S668000, C257S758000, C438S111000, C438S128000

Reexamination Certificate

active

06986197

ABSTRACT:
A method is provided for processing leadframe items of two or more types to form integrated circuit packages. The leadframe items are delivered along respective input paths and are received into holders, which are moved alternately between a processing region and a respective leadframe item reception position on a respective input path such that each of the holders moves to the processing region at a time when the other of the holders moves to its respective reception position. The leadframe items are delivered from the respective reception position to the processing region, and are then sent for encapsulation.

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patent: 2004/0003497 (2004-01-01), Wu et al.

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