Method of manufacturing an IC coil mounted in an information...

Details Method of manufacturing an IC coil mounted in an information... Method of manufacturing an IC coil mounted in an information...

2006-10-31

2006-10-31

Picardat, Kevin M. (Department: 2822)

Semiconductor device manufacturing: process

Making passive device

C438S238000, C438S460000

Reexamination Certificate

active

07129145

ABSTRACT:
An information carrier in which an IC element formed integrally with a coil is mounted and which has an extended communication range and a method of manufacturing the same and a structure of the IC element appropriately suited for this sort of information carrier and a method of manufacturing the same. In the IC element, a conductor constituting the coil3is implemented in a multilayer structure including a metal-sputtered layer or alternatively a metal-evaporated layer6and a metal-plated layer7. In the method of manufacturing the IC element, a precision electroforming method is employed as a means for forming the metal-plated layer7. The information carrier is implemented in such a structure in which the IC element1is disposed at a center portion in a planar direction of a substrate21. In a method of manufacturing the information carrier, strip material or materials41to45a given one of which has mounted thereon desired parts inclusive of the IC elements are manufactured, whereon desired information carriers20a, . . . , 20hare formed by punching the strip material(s).

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