Fishing – trapping – and vermin destroying
Patent
1991-12-31
1993-12-21
Wilczewski, Mary
Fishing, trapping, and vermin destroying
437126, 437132, 437133, 437107, 148DIG65, H01L 2120, H01L 3110, H01L 3118
Patent
active
052721051
ABSTRACT:
Heteroepitaxial semiconductor structures of, for example, GaAs on InP or Si. The epitaxially grown GaAs is in the form of individual spaced-apart islands having maximum dimensions in the plane of the surface of the substrate of no greater than 10 micrometers. In islands of this size stress in the plane of the epitaxially grown layers due to mismatch of the coefficients of thermal expansion of the substrate and epitaxially grown materials is insignificant.
REFERENCES:
patent: 3963538 (1976-06-01), Broadie et al.
patent: 4065742 (1977-12-01), Kendall et al.
patent: 4632712 (1986-12-01), Fan et al.
patent: 4806996 (1989-02-01), Luryi
patent: 5030583 (1991-07-01), Beetz, Jr.
Yacobi et al., "Stress Variations and Relief in Patterned GaAs Grown on Mismatched Substrates", Appl. Phys. Lett., vol. 52, No. 7, Feb. 15, 1988, pp. 557-557.
Shaw, "Epitaxial GaAs on Si: Progress and Potential Applications," Matls. Res. Society Symposia Proceedings, vol. 91, Heteroepitaxy on Silicon II, 1987, pp. 15-30.
Yao et al., "Residual Stress in GaAs Layer Grown on 4.degree.-off (100)Si by MBE", Materials Research Society Symposia Proceedings, vol. 91, Heteroepitaxy on Silicon II, 1987, pp. 63-68.
Milnes, "Semiconductor Heterojunction Topics: Introduction and Overview", Solid State Electronics, vol. 29, No. 2, 1986, pp. 99-121.
Sheldon et al., "Selective Patterning of Single Crystal GaAs/Ge Structures on Si Substrates by MBE", J. Vac. Sci. Technol. A, vol. 3, No. 3, May/Jun. 1985, pp. 883-886.
Solid State Technology: vol. 30, No. 11, Nov. 1987, Washington US, pp. 91.sub.]97; K. Kaminishi: "GaAs on Si technology."
Patent Abstracts of Japan: vol. 7, No. 62 (E-164) (1207) Mar. 15, 1983, & JP-A-57 210622 (Citizen Tokei K.K.) Dec. 24, 1982.
Patent Abstracts of Japan: vol. 6, No. 67 (E-104) (945) Apr. 28, 1982, & JP-A-57 10225 (Nippon Denki K.K.) Jan. 19, 1982.
Applied Physics Letters: vol. 51, No. 1, Jul. 6, 1987, New York US, pp. 18-20; R. J. Matyi et al.: "Microstructural . . . Substrates."
Jagannath Chirravuri
Yacobi Ben G.
Zemon Stanley
GTE Laboratories Incorporated
Lohmann, III Victor F.
Wilczewski Mary
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