Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1997-01-09
1998-07-07
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
1563084, 29855, B32B 3100
Patent
active
057762783
ABSTRACT:
The present invention teaches a method of manufacturing an enclosed transceiver, such as a radio frequency identification ("RFID") tag. Structurally, in one embodiment, the tag comprises an integrated circuit (IC) chip, and an RF antenna mounted on a thin film substrate powered by a thin film battery. A variety of antenna geometries are compatible with the above tag construction. These include monopole antennas, dipole antennas, dual dipole antennas, a combination of dipole and loop antennas. Further, in another embodiment, the antennas are positioned either within the plane of the thin film battery or superjacent to the thin film battery.
REFERENCES:
patent: 3706094 (1972-12-01), Cole et al.
patent: 3750167 (1973-07-01), Gehman et al.
patent: 3780368 (1973-12-01), Northeved et al.
patent: 3832530 (1974-08-01), Reitboeck et al.
patent: 3849633 (1974-11-01), Reitboeck et al.
patent: 4049969 (1977-09-01), Salonimer et al.
patent: 4226361 (1980-10-01), Taylor
patent: 4331957 (1982-05-01), Enander et al.
patent: 4399441 (1983-08-01), Vaughn et al.
patent: 4418411 (1983-11-01), Strietzel
patent: 4453074 (1984-06-01), Weinstein
patent: 4484355 (1984-11-01), Henke et al.
patent: 4649233 (1987-03-01), Bass et al.
patent: 4680724 (1987-07-01), Sugiyama et al.
patent: 4724427 (1988-02-01), Carroll
patent: 4727560 (1988-02-01), Van Zanten et al.
patent: 4746618 (1988-05-01), Nath et al.
patent: 4746830 (1988-05-01), Holland
patent: 4756717 (1988-07-01), Sturgis et al.
patent: 4777563 (1988-10-01), Teraoka et al.
patent: 4783646 (1988-11-01), Matsuzaki
patent: 4827110 (1989-05-01), Rossi et al.
patent: 4827395 (1989-05-01), Anders et al.
patent: 4854328 (1989-08-01), Pollack
patent: 4882294 (1989-11-01), Christenson
patent: 4908502 (1990-03-01), Jackson
patent: 4911217 (1990-03-01), Dunn et al.
patent: 4918631 (1990-04-01), Hara et al.
patent: 4942327 (1990-07-01), Wantanabe et al.
patent: 4960983 (1990-10-01), Inoue
patent: 4962415 (1990-10-01), Yamamoto et al.
patent: 5008776 (1991-04-01), Queyssac
patent: 5023573 (1991-06-01), Adam
patent: 5068894 (1991-11-01), Hoppe
patent: 5095240 (1992-03-01), Nyson et al.
patent: 5144314 (1992-09-01), Malmberg et al.
patent: 5148504 (1992-09-01), Levi et al.
patent: 5153710 (1992-10-01), McCain
patent: 5166502 (1992-11-01), Rendleman et al.
patent: 5214410 (1993-05-01), Verster
patent: 5274221 (1993-12-01), Matsubara
patent: 5302954 (1994-04-01), Brooks et al.
patent: 5313211 (1994-05-01), Tokuda et al.
patent: 5326652 (1994-07-01), Lake
patent: 5337063 (1994-08-01), Takahira
patent: 5350645 (1994-09-01), Lake et al.
patent: 5414427 (1995-05-01), Gunnarsson
patent: 5416423 (1995-05-01), De Borde
patent: 5432027 (1995-07-01), Tuttle et al.
patent: 5434397 (1995-07-01), Diehl et al.
patent: 5448110 (1995-09-01), Tuttle et al.
patent: 5480462 (1996-01-01), Tuttle
patent: 5486431 (1996-01-01), Tuttle et al.
patent: 5494495 (1996-02-01), Tuttle
patent: 5497140 (1996-03-01), Tuttle
patent: 5510074 (1996-04-01), Rose
K. Casson et al., "High Temperature Packaging: Flip Chip on Flexible Laminate", Jan. 1992, Surface Mount Technology, pp. 19-20.
R.W. Johnson, "Polymer Thick Films: Technology and Materials", Jul. 1982, Circuits Manufacturing (reprint).
K. Gilleo, "Using SM Devices On Flexible Circuitry", Mar. 1986, Electri-onics, pp. 20-23.
M.G. Kanarzibis "Conductive Polymers", Dec. 3, 1990, Chemical and Engineering News -American Chemical Society, pp. 36-54.
Lake Rickie C.
Tuttle John R.
Tuttle Mark E.
Micron Communications Inc.
Rivard Paul M.
Simmons David A.
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