Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Reexamination Certificate
2004-11-10
2008-12-09
Mayes, Melvin C (Department: 1791)
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
To produce composite, plural part or multilayered article
C264S272130, C264S272190, C336S090000
Reexamination Certificate
active
07462317
ABSTRACT:
A method of manufacturing an encapsulated package for a magnetic device on a substrate. In one embodiment, the method includes providing a magnetic core on the substrate and placing a shielding structure over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about a portion of the magnetic core within the chamber. The shielding structure limits the encapsulant entering the chamber.
REFERENCES:
patent: 1889398 (1932-11-01), Bishop
patent: 2600473 (1952-06-01), Brockman
patent: 3691497 (1972-09-01), Bailey et al.
patent: 3908264 (1975-09-01), Friberg et al.
patent: 4199743 (1980-04-01), Martincic
patent: 4433927 (1984-02-01), Cavallari
patent: 4586436 (1986-05-01), Denney et al.
patent: 4681718 (1987-07-01), Oldham
patent: 4847986 (1989-07-01), Meinel
patent: 4870224 (1989-09-01), Smith et al.
patent: 4916522 (1990-04-01), Cohn
patent: 4975671 (1990-12-01), Dirks
patent: 5056214 (1991-10-01), Holt
patent: 5285369 (1994-02-01), Balakrishnan
patent: 5345670 (1994-09-01), Pitzele et al.
patent: 5353001 (1994-10-01), Meinel et al.
patent: 5469334 (1995-11-01), Balakrishnan
patent: 5524334 (1996-06-01), Boesel
patent: 5574420 (1996-11-01), Roy et al.
patent: 5578261 (1996-11-01), Manzione et al.
patent: 5692296 (1997-12-01), Variot
patent: 5787569 (1998-08-01), Lotfi et al.
patent: 5802702 (1998-09-01), Fleming et al.
patent: 6005377 (1999-12-01), Chen et al.
patent: 6094123 (2000-07-01), Roy
patent: 6118351 (2000-09-01), Kossives et al.
patent: 6255714 (2001-07-01), Kossives et al.
patent: 6440750 (2002-08-01), Feygenson et al.
patent: 6479981 (2002-11-01), Schweitzer, Jr. et al.
patent: 6495019 (2002-12-01), Filas et al.
patent: 6541819 (2003-04-01), Lotfi et al.
patent: 6549409 (2003-04-01), Saxelby, Jr. et al.
patent: 6578253 (2003-06-01), Herbert
patent: 6624498 (2003-09-01), Filas et al.
patent: 6649422 (2003-11-01), Kossives et al.
patent: 6731002 (2004-05-01), Choi
patent: 6747538 (2004-06-01), Kuwata et al.
patent: 6912781 (2005-07-01), Morrison et al.
patent: 6989121 (2006-01-01), Thummel
patent: 6998952 (2006-02-01), Zhou et al.
patent: 7015544 (2006-03-01), Lotfi et al.
patent: 7019505 (2006-03-01), Dwarakanath et al.
patent: 7020295 (2006-03-01), Hamada et al.
patent: 7038438 (2006-05-01), Dwarakanath et al.
patent: 7057486 (2006-06-01), Kiko
patent: 7101737 (2006-09-01), Cobbley
patent: 7180395 (2007-02-01), Lotfi et al.
patent: 7214985 (2007-05-01), Lotfi et al.
patent: 7230302 (2007-06-01), Lotfi et al.
patent: 7236086 (2007-06-01), Vinciarelli et al.
patent: 7250842 (2007-07-01), Johnson et al.
patent: 7256674 (2007-08-01), Lotfi et al.
patent: 7276998 (2007-10-01), Lotfi et al.
patent: 7330017 (2008-02-01), Dwarakanath et al.
patent: 2001/0030595 (2001-10-01), Hamatani et al.
patent: 2003/0076662 (2003-04-01), Miehling
patent: 2005/0167756 (2005-08-01), Lotfi et al.
patent: 2005/0168203 (2005-08-01), Dwarakanath et al.
patent: 2005/0168205 (2005-08-01), Dwarakanath et al.
patent: 2005/0169024 (2005-08-01), Dwarakanath et al.
patent: 2006/0038225 (2006-02-01), Lotfi et al.
patent: 2006/0096087 (2006-05-01), Lotfi et al.
patent: 2006/0145800 (2006-07-01), Dadafshar et al.
patent: 2 041 818 (1980-09-01), None
patent: 402228013 (1990-09-01), None
patent: 5-314885 (1993-11-01), None
patent: 6-251958 (1994-09-01), None
Betancourt-Zamora, R.J. et al., “A 1.5 mW, 200 MHz CMOS VCO for Wireless Biotelemetry,” First International Workshop on Design of Mixed-Mode Integrated Circuits and Applications, Cancun, Mexico, pp. 72-74, Jul. 1997.
Goodman, J. et al., “An Energy/Security Scalable Encryption Processor Using an Embedded Variable Voltage DC/DC Converter,” IEEE Journal of Solid-State Circuits, vol. 33, No. 11 (Nov. 1998).
Horowitz, P., et al., “The Art of Electronics,” Second Edition, 1989, pp. 288-291, Cambridge University Press, Cambridge, MA.
Lotfi, A.W., et al., “Issues and Advances in High-Frequency Magnetics for Switching Power Supplies,” Proceedings of the IEEE, Jun. 2001, vol. 89, No. 6, pp. 833-845.
Sato, et al., “Influences of Molding Conditions on Die-Pad Behavior in IC Encapsulation Process Analyzed by Hall Element Method,” IEEE Transactions on Advanced Packaging, Aug. 2000, pp. 574-581, vol. 23, No. 3, IEEE, Los Alamitos, CA.
Lotfi Ashraf W.
Weld John D.
Wilkowski Mathew
Enpirion, Inc.
Mayes Melvin C
Slater & Matsil L.L.P.
LandOfFree
Method of manufacturing an encapsulated package for a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing an encapsulated package for a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing an encapsulated package for a... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4040085