Method of manufacturing an electronic parts packaging structure

Details Method of manufacturing an electronic parts packaging structure Method of manufacturing an electronic parts packaging structure

2008-01-15

2008-01-15

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257S700000, C257S723000, C257S773000, C257S686000, C257S774000, C257S777000, C257SE21511

Reexamination Certificate

active

11114168

ABSTRACT:
A method of manufacturing an electronic parts packaging structure of the present invention, includes the steps of forming a first uncured resin layer on a substrate, arranging an electronic parts on the first uncured resin layer, forming a second uncured resin layer that covers the electronic parts, and obtaining an insulating layer, in which the electronic parts is embedded, by curing the first uncured resin layer and the second uncured resin layer by annealing.

REFERENCES:
patent: 6590291 (2003-07-01), Akagawa
patent: 6734542 (2004-05-01), Nakatani et al.
patent: 6784530 (2004-08-01), Sugaya et al.
patent: 6841413 (2005-01-01), Liu et al.
patent: 6858892 (2005-02-01), Yamagata
patent: 2002/0175402 (2002-11-01), McCormack et al.
patent: 2002-261449 (2002-09-01), None

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