Method of manufacturing an electronic multilayer component

Details Method of manufacturing an electronic multilayer component Method of manufacturing an electronic multilayer component

1996-03-25

1999-03-02

Eley, Timothy V.

Metal working

Piezoelectric device making

29 2542, 29620, 427 79, 427100, H01G 700

Patent

active

058755314

ABSTRACT:
A method of manufacturing a plurality of electronic multilayer component search of which alternately stacked electrically conductive and insulating layers alternately connected to opposite edges of the component, which method comprises: providing a substrate having a face endowed with a regular pattern of substantially parallel elongated protrusions separated by valleys; providing a first and a second flux of electrically conductive material in a direction subtending an angle of less than 90 with the substrate face and extending substantially parallel to the surface protrusions, and covering the thus-formed electrically conductive layers with intervening electrically insulating layers, the first and second fluxes having substantially oppositely directed in-plane components; providing said first and second fluxes with intervening insulating layers in an alternate manner as often as desired; dividing the substrate into strips, each including a protrusion, by severing the substrate along a series of planes, each of which plane extends along a valley in a direction substantially parallel to the protrusions; and providing electrically conductive material upon each resulting exposed side faces of the strips so as to provide a mutual electrical contact between the electrically conductive layers terminating in that exposed side face.

REFERENCES:
patent: 3326718 (1967-06-01), Dill

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