Method of manufacturing an electronic multilayer component

Details Method of manufacturing an electronic multilayer component Method of manufacturing an electronic multilayer component

1996-03-25

1999-08-17

Eley, Timothy V.

Metal working

Piezoelectric device making

29 2542, 29620, 427 79, 427100, H01G 700

Patent

active

059374934

ABSTRACT:
A method of manufacturing a plurality of electronic multilayer components is disclosed in which each multilayer component comprises alternately stacked electrically conductive layers and electrically insulating layers, the electrically conductive layers being electrically connected in a periodically alternate arrangement to different edges of the multilayer component. The method comprises the steps of providing a substrate which is endowed with a regular pattern of surface protrusions on one face; depositing individual multilayer components into intervening spaces delimited by the protrusions; depositing electrically conductive layers for connection to a given edge of a multilayer component, wherein each connection occurs at an angle (.theta.) of less than 90.degree. with respect to the substrate face in a direction extending towards the surface protrusion delimiting the respective edge; depositing each electrically insulating layer so as to completely cover a preceding electrically conductive layer; after deposition of the desired multilayer composition, planing the side of the substrate on which deposition occurred so as to expose edges of the electrically conductive layers; depositing a connecting body of electrically conductive material over selected groupings of the exposed edges; and separating completed individual multilayer components from one another by severing the substrate along the surface protrusions.

REFERENCES:
patent: 3326718 (1967-06-01), Dill

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