Method of manufacturing an electronic identification card

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156253, 156261, 156289, 156297, 283904, 427195, 427282, 427384, B32B 3104, B32B 3108, B32B 3110, B32B 3112

Patent

active

047012366

ABSTRACT:
The method and arrangement according to the invention utilize an adhesive tape (1) covered with a protective layer (2) provided with openings (4).
This tape is glued on a film (5) carrying contact metallizations (8) and integrated circuit chips (6) electrically connected to the said metallizations. The tape is glued on the film in such a manner that its openings (4) correspond to the positions of the integrated circuit chips (6). Subsequently, a coating varnish is applied by pulverization to the film and then the protective layer is removed with the varnish covering it. Vignettes slightly larger than the said openings are then cut in the film in such a manner that an adhesive ring is left around the integrated circuit chips. Each vignette is finally arranged in a recess ad hoc (12) of a card (10).

REFERENCES:
patent: 3689991 (1972-09-01), Aird
patent: 4150211 (1979-04-01), Muller et al.
patent: 4360559 (1982-11-01), Dalencon
patent: 4463971 (1984-08-01), Hoppe et al.
patent: 4474292 (1984-10-01), Haghiri-Tehrani
patent: 4483067 (1984-11-01), Parmentier
patent: 4552383 (1985-11-01), Hoppe et al.
patent: 4587413 (1986-05-01), Hoppe et al.
patent: 4617216 (1986-10-01), Haghiri-Tehrani

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