Method of manufacturing an electronic device

Details Method of manufacturing an electronic device Method of manufacturing an electronic device

2007-01-09

2007-01-09

Ahmed, Shamim (Department: 1765)

Etching a substrate: processes

Forming or treating electrical conductor article

C216S002000, C216S083000, C438S125000, C438S455000, C438S456000, C438S457000, C438S459000, C257S328000

Reexamination Certificate

active

10510590

ABSTRACT:
The electronic device (100) comprises an electrical element (30), for instance a MEMS capacitor or a BAW filter in a cavity (37) that is protected from the environment by a cover (38). The cover (38) is a patterned layer which is mechanically embedded in isolating material (7) present beside the cavity (37) and may further include contact pads (41). The device (100) may be suitably manufactured from an accurately folded foil including a patterned layer and a sacrifice layer. After applying the foil to the cavity (37) the isolating material (7) is provided and the sacrifice layer is removed. The patterned layer, or part thereof, stays behind and forms the cover (38).

REFERENCES:
patent: 5043534 (1991-08-01), Mahulikar et al.
patent: 5155299 (1992-10-01), Mahulikar et al.
patent: 5738797 (1998-04-01), Belke et al.
patent: 6146917 (2000-11-01), Zhang et al.

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