Method of manufacturing an electronic component and an...

Details Method of manufacturing an electronic component and an... Method of manufacturing an electronic component and an...

2007-12-06

2010-11-16

Andújar, Leonardo (Department: 2826)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257S778000

Reexamination Certificate

active

07833831

ABSTRACT:
An electronic component is equipped with electrode protrusions that make it possible to mount the electronic component without covering connection pads of a circuit board with solder and to dispose the connection pads of the circuit board with a narrow pitch while preventing electrical shorting of the connection electrodes during mounting. A method of manufacturing an electronic component equipped with connection electrodes, where electrode protrusions are covered with solder, includes a step of heating a solder sheet to a semi-molten state and pressing the electronic component onto the solder sheet to place the electrode protrusions in contact with the solder sheet and a step of retracting the electronic component from a position where the electrode protrusions contact the solder sheet to transfer solder onto outside surfaces of the electrode protrusions that contacted the solder sheet.

REFERENCES:
patent: 5973406 (1999-10-01), Harada et al.
patent: 6454159 (2002-09-01), Takushima
patent: 6761302 (2004-07-01), Kaneyama
patent: 8-203904 (1996-08-01), None
patent: 10-70153 (1998-03-01), None
patent: 11-163199 (1999-06-01), None
patent: 2000-77471 (2000-03-01), None
patent: 3123707 (2000-10-01), None

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