Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2007-11-06
2011-11-22
Tucker, Philip (Department: 1745)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S250000, C156S252000, C156S253000, C438S033000, C438S106000, C438S107000, C438S110000, C438S113000, C438S118000
Reexamination Certificate
active
08062461
ABSTRACT:
The disclosure is directed to method for manufacturing an electro-optical device. In one example, a method comprises forming a plurality of scribe lines in a substrate; forming cracks in the substrate which pass from the scribe lines through the substrate; and forming a plurality of dicing lines in the substrate along the scribe lines and the cracks. In one example, the dicing lines are formed at a depth that is less than a thickness of the substrate. This abstract is intended only to aid those searching patents, and is not intended to be used to interpret or limit the scope or meaning of the claims in any manner.
REFERENCES:
patent: 6747725 (2004-06-01), Chae et al.
patent: 7523846 (2009-04-01), Takamatsu et al.
patent: 2004/0166654 (2004-08-01), Matsuda et al.
patent: 2005/0101109 (2005-05-01), Chin et al.
patent: 2006-098632 (2006-04-01), None
AdvantEdge Law Group, LLC
Caillouet Christopher C
Seiko Epson Corporation
Tucker Philip
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