Method of manufacturing an electric component which can be mount

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area

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205125, 205126, 205252, 438113, 29840, 29846, 29411, 29412, 427 98, 427 99, C25D 502

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active

059482338

ABSTRACT:
Electric component which can be mounted on the surface of a printed circuit board as well as a method of manufacturing such components. The invention relates to an electric component (surface mountable component) which can be mounted on the surface of a printed circuit board, and to a method of manufacturing said component. Such a component comprises a thin, electroconductive layer or stack of layers which is provided with end contacts and arranged on a support of an electrically insulating material. In accordance with the invention, the dimension of the layer or stack of layers in at least one direction parallel to the surface of the support is smaller than the dimension of the support in said direction, while leaving portions of the surface of the support clear on at least two sides of the layer or stack of layers, and end contacts for the layer or stack of layers are situated on the surface portions of the support which are free of this layer or stack of layers, the thickness of said end contacts being larger than the thickness of the layer or stack of layers. The method in accordance with the invention enables small-size electric components to be manufactured in which the end contacts form a reliable electric connection with the electroconductive layer or stack of layers of the component.

REFERENCES:
patent: 4097986 (1978-07-01), Henry et al.
patent: 4984130 (1991-01-01), Diill et al.
patent: 5053916 (1991-10-01), Weekamp et al.
patent: 5656547 (1997-08-01), Richards et al.
patent: 5683566 (1997-11-01), Hetzler
patent: 5858815 (1999-01-01), Heo et al.

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