Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1981-03-10
1982-10-26
Thibodeau, Paul J.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
29592E, 156196, 179111E, 428156, B32B 330, H04R 1900
Patent
active
043560490
ABSTRACT:
A method of manufacturing an electret device which comprises the step of causing a pressure deformation jig whose surface is provided with numerous minute convex and concave regions to abut against the surface of a raw dielectric material for an electret and later be removed therefrom, thereby forming minute stretched and contracted region on the surface of said dielectric material.
REFERENCES:
patent: 3949178 (1976-04-01), Hellstrom et al.
patent: 3967027 (1976-06-01), Igarashi et al.
"Electric Charge Generated in Polymethylmethacrylate by Compressive Deformation", Novikov et al., Soviet Physics-Solid State, vol. 8, No. 5, May 1966, pp. 1240-1244.
Kobayashi Masami
Kotoh Takehiko
Tamura Sakae
Yoshida Hiromi
Thibodeau Paul J.
Tokyo Shibaura Denki Kabushiki Kaisha
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