Metal fusion bonding – Process – Using bond inhibiting separating material
Patent
1993-04-28
1993-11-23
Ramsey, Kenneth J.
Metal fusion bonding
Process
Using bond inhibiting separating material
228157, 228186, 228193, 21912114, B23K 2018
Patent
active
052636380
ABSTRACT:
A stack of titanium sheets are placed on a worktable in a vacuum chamber. One of the mating surfaces of each pair of mating surfaces has had a stop off material applied in a desired pattern to prevent diffusion bonding. A pump evacuates the vacuum chamber and heaters heat the stack to evaporate volatile binder from the stop off. When all the binder has been removed the worktable is moved relative to an electron beam gun to weld the edges of the sheets together to form a sealed assembly. The volatile binder is removed quickly and oxidation of the titanium is prevented during baking out of the binder. The sealed assembly is then heated and externally pressurised to diffusion bond the sheets together. The integral structure is then heated and internally pressured to superplastically form one of the sheets to produce an article of predetermined shape.
REFERENCES:
patent: 3842236 (1974-10-01), Von Walter
patent: 3980220 (1976-09-01), Wolfe et al.
patent: 4220276 (1980-09-01), Weisert et al.
patent: 4474044 (1984-10-01), Leistner et al.
patent: 4500033 (1985-02-01), Schulz et al.
patent: 4549685 (1985-10-01), Paez
patent: 4811890 (1989-03-01), Dowling et al.
patent: 5024368 (1991-06-01), Bottomley et al.
patent: 5024369 (1991-06-01), Froes et al.
patent: 5069383 (1991-12-01), Cooper et al.
Ramsey Kenneth J.
Rolls-Royce plc
LandOfFree
Method of manufacturing an article by superplastic forming and d does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing an article by superplastic forming and d, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing an article by superplastic forming and d will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1842087