Method of manufacturing an array of surface mount contacts

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29845, H05K 330, H01R 4300

Patent

active

058506934

ABSTRACT:
An electronic socket adapter includes an insulative carrier and an array of a plurality of surface mount contacts carried on the base. The pins may be floatably mounted on the carrier. A plurality of relatively large openings are formed in the carrier between adjacent contacts in the array. The openings provide improved heat flow in the region of the surface mount portions of the contacts and also provide for visualization of the surface mount portions of the contacts during and after soldering.

REFERENCES:
patent: 4236776 (1980-12-01), Wellington
patent: 4442938 (1984-04-01), Murphy
patent: 4934944 (1990-06-01), Kozel et al.
patent: 5147209 (1992-09-01), Litwin et al.
patent: 5279028 (1994-01-01), McKee et al.

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