Method of manufacturing an acoustic wave device

Details Method of manufacturing an acoustic wave device Method of manufacturing an acoustic wave device

2007-11-28

2010-11-30

Kim, Paul D (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S025350, C029S595000, C029S609100, C205S199000, C205S122000, C310S366000, C310S320000, C310S344000, C333S150000, C333S187000, C333S193000, C333S195000, C333S196000

Reexamination Certificate

active

07841064

ABSTRACT:
A method of manufacturing an acoustic wave device includes forming a first sealing portion on a substrate having an acoustic wave element thereon so that a functional region, in which an acoustic wave oscillates, of the acoustic wave element acts as a first non-covered portion and a cutting region for individuating acts as a second non-covered portion, forming a second sealing portion on the first sealing portion so as to cover the first non-covered portion and the second non-covered portion, and cutting off the substrate and the second sealing portion so that the second non-covered portion is divided.

REFERENCES:
patent: 6703768 (2004-03-01), Kageyama et al.
patent: 7259500 (2007-08-01), Iwamoto et al.
patent: 2002/0056897 (2002-05-01), Yatsuda
patent: 2004/0251777 (2004-12-01), Yamamoto et al.
patent: 2006/0192462 (2006-08-01), Iwamoto et al.
patent: 9-232900 (1997-09-01), None
patent: 2002-261582 (2002-09-01), None
patent: 2003-37471 (2003-02-01), None

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