Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1992-12-10
1994-02-08
Silbaugh, Jan H.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156325, C04B 3700
Patent
active
052845370
ABSTRACT:
In an aluminum nitride structure, a plurality of aluminum nitride regions having different purities are integrally formed to satisfy a predetermined positional relationship, and neighboring regions are brought into direct contact with each other to form an abrupt junction therebetween. Therefore, the aluminum nitride structure has anisotropy in physical properties such as a thermal conductivity, a light transmittance, and a strength.
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Toshiba Review 44[8]1989; A. Horiguchi et al; "Development of High-Thermal Conductivity Aluminum Nitride Ceramics", pp. 616-618 Only Abstract Translated.
Journal of Materials Science Letters 3(1984), N. Kuramoto et al; "Transparent AIN Ceramics", pp. 471-474.
Goto Yoshiko
Horiguchi Akihiro
Kasori Mitsuo
Ueno Fumio
Fiorilla Christopher A.
Kabushiki Kaisha Toshiba
Silbaugh Jan H.
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