Method of manufacturing acceleration sensor

Details Method of manufacturing acceleration sensor Method of manufacturing acceleration sensor

2005-02-22

2005-02-22

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

C438S049000, C438S050000, C438S051000, C438S052000, C438S053000, C257S232000, C257S233000, C257S234000

Reexamination Certificate

active

06858457

ABSTRACT:
Provided is a method of manufacturing an acceleration sensor capable of preventing bonding of a movable electrode and a fixed electrode. A stain film8for reducing bonding adsorption force is formed on side surfaces of a movable electrode1, fixed electrodes2aand2band a frame portion7.In the case in which the movable electrode1and the fixed electrodes2aand2bare to be formed of a silicon substrate, it is preferable that an insulating film having irregular bonding of silicon atoms and oxygen atoms and irregular bonding of silicon atoms and nitrogen atoms should be employed for the stain film8,for example. The formation of the stain film8can suppress the bonding between the movable electrode1and the fixed electrodes2aand2beven if Coulomb force is generated between both electrodes when the silicon substrate and a back side substrate4are joined by using an anode junction method.

REFERENCES:
patent: 6287885 (2001-09-01), Muto et al.

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