Method of manufacturing a wiring substrate

Details Method of manufacturing a wiring substrate Method of manufacturing a wiring substrate

2007-02-06

2009-10-06

Tran, Binh X (Department: 1792)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C427S097200, C427S097300, C427S097700, C427S099400, C427S117000

Reexamination Certificate

active

07597929

ABSTRACT:
A method of manufacturing a wiring substrate of the present invention includes the steps of, preparing a laminated body having such a structure that a peelable metal foil in which a lower metal foil and an upper metal foil are laminated peelably and an opening portion is provided on a peripheral side is pasted onto a supporting body, forming a through hole having a diameter smaller than the opening portion by processing a portion of the supporting body on an inner side of the opening portion to obtain a reference hole having a projection portion in an inside, forming a resin layer on the peelable metal foil and the projection portion in the reference hole to cover a side surface of the opening portion, and then forming a build-up wiring on the resin layer, removing portions of the build-up wiring and the laminated body corresponding to an area containing the opening portion to expose a peeling boundary of the peelable metal foil, peeling the upper metal foil from the lower metal foil at a boundary to separate the upper metal foil and the build-up wiring from the supporting body side, and removing the upper metal foil from the build-up wiring.

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