Method of manufacturing a wiring board by utilizing electro...

Details Method of manufacturing a wiring board by utilizing electro... Method of manufacturing a wiring board by utilizing electro...

2007-12-28

2011-10-25

Norton, Nadine G (Department: 1713)

Etching a substrate: processes

Forming or treating electrical conductor article

C216S041000

Reexamination Certificate

active

08043514

ABSTRACT:
When a wiring pattern is formed on a wiring board utilizing electroplating, an unnecessary portion is removed by proceeding as follows. First electroless plating layers are formed on both sides of an insulating substrate, which are covered with metallic foils in advance. On the first electroplating layers, wiring patterns are formed by etching so as not to extend to the end edge of the substrate. Then, a plating resist pattern is formed so that only a predetermined portion of the wiring patterns is exposed and a second electroplating layer is formed on the predetermined portion of the wiring patterns by supplying electric power from second electroless plating layers. Finally, the plating resist pattern and the second electroless plating layers are removed, and a solder resist is formed so that predetermined portions of the wiring patterns are exposed.

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European search report issued in corresponding European Patent Application No. 08007713.4 on Jun. 9, 2008.

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