Method of manufacturing a wiring board

Details Method of manufacturing a wiring board Method of manufacturing a wiring board

2011-03-08

2011-03-08

Nguyen, Donghai D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S832000, C257S775000, C438S118000

Reexamination Certificate

active

07900350

ABSTRACT:
A circuit element comprises a wiring board; the wiring board comprises a substrate and a wiring formed on the substrate, and a lid joined on the substrate containing a part of the wiring with a binder and making a sealed space above the substrate, wherein if a spot of the wiring joined with the lid by a binder is a spot of junction, a flank of both flanks of the wiring comprise bends in the spot of junction.

REFERENCES:
patent: 6060342 (2000-05-01), Montauti et al.
patent: 6495768 (2002-12-01), Cho
patent: 2003-197796 (2003-07-01), None
patent: 2003197796 (2003-07-01), None
Office Action for Chinese Application No. 2006100648166 dated Jul. 31, 2009 and English translation thereof, 7 pages.

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