Method of manufacturing a wiring board

Details Method of manufacturing a wiring board Method of manufacturing a wiring board

2011-06-07

2011-06-07

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S846000, C216S018000

Reexamination Certificate

active

07954234

ABSTRACT:
In a method of manufacturing a wiring board, the method includes: (i) forming a plurality of conductive patterns to come into contact with a support plate; (ii) forming a resin layer to cover the plurality of conductive patterns and to come into contact with the support plate; (iii) forming another conductive pattern connected to at least one of the plurality of conductive patterns; and (iv) removing the support plate. A first area of the support plate coming into contact with at least one of the plurality of conductive patterns in step (i) is different in surface roughness from a second area of the support plate coming into contact with the resin layer in step (ii).

REFERENCES:
patent: 4604160 (1986-08-01), Murakami et al.
patent: 6183588 (2001-02-01), Kelly et al.
patent: 6904674 (2005-06-01), Mune et al.
patent: 7057279 (2006-06-01), Ogawa
patent: 7193311 (2007-03-01), Ogawa et al.
patent: 7235477 (2007-06-01), Ogawa
patent: 7435680 (2008-10-01), Nakamura
patent: 7473992 (2009-01-01), Ogawa
patent: 2003-060356 (2003-02-01), None
patent: 2005-005742 (2005-01-01), None
patent: 2006-186321 (2006-07-01), None

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