Method of manufacturing a thin semiconductor package having many

Details Method of manufacturing a thin semiconductor package having many Method of manufacturing a thin semiconductor package having many

1995-05-04

1997-07-29

Niebling, John

Fishing, trapping, and vermin destroying

437218, 437902, H01L 2160

Patent

active

056521847

ABSTRACT:
The present invention provides a semiconductor device. In the device of the present invention, a metal lead wire is mounted to one surface of a carrier tape. One end of the metal lead wire is connected to a semiconductor chip. A lead frame is mounted to one surface of a reinforcing plate. The other end of the metal lead wire is connected to one end of an inner lead wire. The semiconductor chip is mounted to one surface of the reinforcing plate having an open portion positioned in the tip portion of the inner lead. Further, the semiconductor chip is covered with a resin layer.

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