Method of manufacturing a thin-film circuit substrate having...

Details Method of manufacturing a thin-film circuit substrate having... Method of manufacturing a thin-film circuit substrate having...

2005-09-14

2008-08-19

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

C438S033000, C438S068000, C438S107000, C438S103000, C257S052000, C257S594000, C257S618000

Reexamination Certificate

active

07413965

ABSTRACT:
A method of manufacturing a thin-film circuit substrate, containing:(a) gouging a surface of a circuit substrate in a depth at least approximately equal to a thickness of a final product of the substrate, to form a section to be formed a penetrating section;(b) providing a protecting adhesive tape to adhere to the gouged surface of the substrate, before a backing surface of the substrate is ground;(c) grinding the backing surface in such a thickness that the gouged section would not penetrate;(d) dry etching entirely the backing surface, while the tape adheres to the substrate, after completion of the grinding for the backing surface; and(e) making the gouged section of the substrate to penetrate, by the dry etching, thereby forming the penetrating structure section; and,a protecting adhesive tape usable in the method.

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