Metal fusion bonding – Process – Plural diverse bonding
Patent
1999-08-27
2000-12-26
Ryan, Patrick
Metal fusion bonding
Process
Plural diverse bonding
2281791, 228215, 427 96, 427258, 427384, 427402, 29840, B05D 512, B23K 3102
Patent
active
061645222
ABSTRACT:
An improved method of manufacturing thick film circuit wherein an IC is attached to a central conductor pad with adhesive, and wherein spreading of the adhesive is constrained by a ring of porous dielectric material formed between the central conductor pad and the peripheral conductor pads to which the IC terminals are bonded. When the adhesive material is printed and begins to spread, it contacts the porous dielectric ring, which absorbs the adhesive material and stops the spreading. In this way, the porous dielectric ring controls the dimensions of the cured adhesive, thereby preventing the adhesive from contaminating the peripheral conductor pads. Even with the addition of the intervening dielectric ring, the length of the wire-bond connections and the overall dimension of the IC and its conductor pads are both significantly decreased, contributing to improved circuit area utilization and wire-bond durability.
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Isenberg John Karl
Lautzenhiser Frans Peter
Cooke Colleen
Delphi Technologies Inc.
Funke Jimmy L.
Ryan Patrick
LandOfFree
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