Fishing – trapping – and vermin destroying
Patent
1989-04-03
1991-09-10
Chaudhuri, Olik
Fishing, trapping, and vermin destroying
437229, 437235, 235380, 427 96, H01L 2156
Patent
active
050473689
ABSTRACT:
The invention relates to a method of forming a thick-film circuit arrangement having an electronic circuit which is constructed on a surface (17) of a ceramic substrate plate (3) and which consists of conductor paths (5), resistors, capacitors and components, in particular integrated switching circuits without a housing, formed according to thick-film technique, in this structure has between the electrically conductive structures (5) a sintered, non-conductive paste substantially filling the intermediate spaces between them and both the structures and the interposed pastes are covered by a sintered insulating paste. For concealing the thick-film circuit arrangement from unauthorized access, the following covering construction is carried out:
REFERENCES:
patent: 3564214 (1971-02-01), Cooper
patent: 4202007 (1980-05-01), Douherty et al.
patent: 4434361 (1984-02-01), Meinguss et al.
patent: 4487993 (1984-12-01), Becker
patent: 4558171 (1985-12-01), Gantley et al.
patent: 4650923 (1987-03-01), Nishigaki et al.
patent: 4691350 (1987-09-01), Kleijne et al.
patent: 4820659 (1989-04-01), Dholakia et al.
patent: 4839775 (1989-06-01), Schnitker
Appel Kay
Nover Michael P. J.
Schnitker Wolfgang E.
Chaudhuri Olik
Guiffis Andrew
Miller Paul R.
U.S. Philips Corporation
LandOfFree
Method of manufacturing a thick-film circuit arrangement does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing a thick-film circuit arrangement, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a thick-film circuit arrangement will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-539865