Method of manufacturing a thermal print head

Details Method of manufacturing a thermal print head Method of manufacturing a thermal print head

1984-11-19

1986-02-25

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

29834, 29589, 156230, 156235, 156241, H05K 334, H05K 330

Patent

active

045718261

ABSTRACT:
A method of manufacturing a thermal print head includes the step of coating a channel 12 of a fixture 10 with a first adhesive 26. Integrated circuit packages 20 are placed in the channel 12 with heating elements 22 disposed toward the bottom 14 of the channel 12. The packages 20 are held in position by a jig 30 while the adhesive 26 is thermally activated. A groove 52 in the face of a heat sink 50 is filled with a first part 54 of a two part adhesive and the integrated circuit packages 20 coated with the second part 56 of the two part adhesive. The alignment fixture 10 is positioned over the heat sink 50 activating the two part adhesive. The temperature of the assembly is elevated causing the first adhesive 26 to release and the second adhesive 54, 56 to further cure thus securing the packages 20 to the heat sink 50. Printed circuit cables 60, 70 are soldered to the packages 20.

REFERENCES:
patent: 3655496 (1972-04-01), Ettre et al.
patent: 3808079 (1974-04-01), Akashi et al.
patent: 3846905 (1974-11-01), Harper
patent: 3847697 (1974-11-01), Baker et al.
patent: 3859723 (1975-01-01), Hamer et al.
patent: 3887996 (1975-06-01), Hartleroad et al.
patent: 3899379 (1975-08-01), Wanesky
patent: 3950200 (1976-04-01), Muramoto et al.
patent: 3970494 (1976-07-01), Pritchard
patent: 4210462 (1980-07-01), Tourneux
patent: 4329779 (1982-05-01), England
patent: 4334354 (1982-06-01), Luft et al.
patent: 4343833 (1982-08-01), Sawae et al.
patent: 4345371 (1982-08-01), Ohsawa et al.
patent: 4386464 (1983-06-01), Yanai et al.
patent: 4466181 (1984-08-01), Takishima
patent: 4506272 (1985-03-01), Arai

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