Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent
1998-10-06
2000-08-08
Niebling, John F.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
438108, H01L 2144, H01L 2148, H01L 2150
Patent
active
061001120
ABSTRACT:
A bump-attached tape carrier for mounting a semiconductor chip on a circuit substrate, the bump-attached tape carrier comprising, an insulating film, a conductor pattern formed on the insulating film, and metal bumps formed on the conductor pattern and adapted to be bonded with the semiconductor chip, wherein the metal bumps are respectively formed of a columnar body having a side wall substantially perpendicular to the conductor pattern.
REFERENCES:
patent: 4133935 (1979-01-01), Dawson
patent: 5135606 (1992-08-01), Kato et al.
patent: 5154341 (1992-10-01), Melton et al.
patent: 5233504 (1993-08-01), Melton et al.
patent: 5686352 (1997-11-01), Higgins, III
Amano Toshiaki
Asada Toshiaki
Hamada Masakazu
Jones Joseph
Niebling John F.
The Furukawa Electric Co. Ltd.
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