Method of manufacturing a tape carrier with bump

Details Method of manufacturing a tape carrier with bump Method of manufacturing a tape carrier with bump

1998-10-06

2000-08-08

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438108, H01L 2144, H01L 2148, H01L 2150

Patent

active

061001120

ABSTRACT:
A bump-attached tape carrier for mounting a semiconductor chip on a circuit substrate, the bump-attached tape carrier comprising, an insulating film, a conductor pattern formed on the insulating film, and metal bumps formed on the conductor pattern and adapted to be bonded with the semiconductor chip, wherein the metal bumps are respectively formed of a columnar body having a side wall substantially perpendicular to the conductor pattern.

REFERENCES:
patent: 4133935 (1979-01-01), Dawson
patent: 5135606 (1992-08-01), Kato et al.
patent: 5154341 (1992-10-01), Melton et al.
patent: 5233504 (1993-08-01), Melton et al.
patent: 5686352 (1997-11-01), Higgins, III

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