Method of manufacturing a tab semiconductor package by securing

Details Method of manufacturing a tab semiconductor package by securing Method of manufacturing a tab semiconductor package by securing

1989-08-22

1991-10-15

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437220, H01L 2160, H01L 2158

Patent

active

050574566

ABSTRACT:
On the TAB package (10) including a TAB spider (13) glued to a preformed substrate (15) and provided with leads (12) the ILB ends of which rest on an insulating frame (20), this frame is an element directly mounted on the leads, which is independent of the substrate and has a thickness substantially less than that of the substrate.

REFERENCES:
patent: 3832769 (1974-09-01), Olyphant, Jr. et al.
patent: 3838984 (1974-10-01), Crane et al.
patent: 4435740 (1984-03-01), Huckabee et al.
patent: 4731645 (1988-03-01), Parmentier et al.
Patent Abstracts of Japan, vol. II, NO. 209 (E-52]) (E-521) (2656) Jul. 7, 1987.
Patent Abstracts of Japan JP-A-62 30 342 (NEC Corp.) 09-02-1987.

Affiliated with

Also associated with

Rating

Method of manufacturing a tab semiconductor package by securing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a tab semiconductor package by securing , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a tab semiconductor package by securing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-990816