Method of manufacturing a tab semiconductor device

Details Method of manufacturing a tab semiconductor device Method of manufacturing a tab semiconductor device

1998-03-13

1999-10-26

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

438106, H01L 2144, H01L 2148, H01L 2150

Patent

active

059727390

ABSTRACT:
A resin-encapsulated semiconductor device includes a semiconductor chip consisting of a semiconductor element having metal bumps and metal leads electrically connected to the metal bumps and having a surface-treated layer obtained by a surface treatment, and a resin film stacked on the outer side of the semiconductor chip and tightly adhered to the semiconductor chip by a heat treatment and pressurization treatment.

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