Method of manufacturing a system in package

Details Method of manufacturing a system in package Method of manufacturing a system in package

2011-06-14

2011-06-14

Lebentritt, Michael S (Department: 2829)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C438S004000, C438S014000, C438S016000, C438S017000, C324S750300, C702S058000, C702S118000

Reexamination Certificate

active

07960189

ABSTRACT:
A system in package (10) has a, preferably wireless, test controller (20) for testing each die (30) after it has been mounted onto the substrate of the system in package (10), and a faulty die (30) is repaired before a next die (30) is mounted onto the substrate (15). This way, the system in package (10) can be tested during the intermediate stages of its manufacturing, thus ensuring that all dies (30) function correctly before sealing the dies in the single package. Consequently, a method for manufacturing a system in package (10) is obtained that has an improved yield compared to known manufacturing methods.

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