Method of manufacturing a switch substrate

Details Method of manufacturing a switch substrate Method of manufacturing a switch substrate

1991-11-29

1993-09-07

Silbaugh, Jan H.

Plastic and nonmetallic article shaping or treating: processes

Forming electrical articles by shaping electroconductive...

264250, 26427211, 26427215, 264275, B29C 3904, B29C 6902

Patent

active

052426424

ABSTRACT:
A switch substrate for a switching device that includes an electrical contact brush, the substrate formed with alternating conductive and insulating portions on its surface and having a groove formed between the conductive and insulating portions to eliminate insulating abrasion powder from the surface of the contact brush. The top of the conducting portions is higher than the bottom of the groove but can be above or below the surface of the insulating portions. To form such a substrate, a conductive layer having projections is formed and is engaged with a mold so that the projections are compressed. After the substrate is removed from the mold, the compressed projections extend to their actual height.

Affiliated with

Also associated with

Rating

Method of manufacturing a switch substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a switch substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a switch substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-485705