Method of manufacturing a surface-mountable device for protectio

Details Method of manufacturing a surface-mountable device for protectio Method of manufacturing a surface-mountable device for protectio

1998-01-20

1999-11-02

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29623, 337290, 337297, H01R 4300

Patent

active

059746610

ABSTRACT:
The thin film, circuit device is a subminiature overvoltage protection device in a surface mountable configuration for use in printed circuit board or thick film hybrid circuit technology. The surface mountable device (SMD) is designed to protect against electrostatic discharge (ESD) damage to electronic components.
The circuit protection device comprises three material subassemblies. The first subassembly generally includes a substrate carrier, electrodes, and terminal pads for connecting the protection device to a PC board. The second subassembly includes a voltage variable polymer material with non-linear characteristics, and the third subassembly includes a cover coat for protecting the circuit protection device.

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