Method of manufacturing a substrate of a rotary encoder

Details Method of manufacturing a substrate of a rotary encoder Method of manufacturing a substrate of a rotary encoder

2006-08-01

2006-08-01

Kim, Paul D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S592100, C029S606000, C029S841000, C029S847000, C029S851000, C100S214000, C250S231130, C250S210000, C156S293000, C156S295000, C156S311000, C451S004000, C451S051000

Reexamination Certificate

active

07082669

ABSTRACT:
A two-phase rotary encoder is provided which includes a substrate for the encoder which is double-faced and has a copper-foil-bonded substrate etched thereon, a first ring-shaped electrode pattern and a second ring-shaped electrode pattern formed concentrically around a center hole on the substrate, a smooth, level ring-shaped comb electrode pattern formed on an outermost periphery of the substrate, wiring patterns which cover the electrode patterns through each of external connecting terminals provided on the substrate, and a common external connecting terminal provided on an edge of the substrate, formed on a surface thereof via the center hole or a through hole. The rotary encoder further includes a resin-molded case, a shaft, a gear-shaped rotor, a click mechanism and a tact switch mechanism.

REFERENCES:
patent: 5006703 (1991-04-01), Shikunami et al.
patent: 6546872 (2003-04-01), Huffer et al.
patent: 6774355 (2004-08-01), Kudo
patent: 6890449 (2005-05-01), Kawamoto et al.
patent: 60210717 (1985-10-01), None
“CMOS front-end for optical rotary encoders”; Maschera, D.; Simoni, A.; Gonzo, L.; Gottardi, M.; Gregori, S.; Liberali, V.; Torelli, G.; Electronics, Circuits and Systems, 2000.; Dec. 17-20, 2000.; pp.: 891-894.

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