Method of manufacturing a substrate for mounting electronic comp

Details Method of manufacturing a substrate for mounting electronic comp Method of manufacturing a substrate for mounting electronic comp

1989-04-28

1990-03-20

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

156629, 156630, 156652, 174262, H01R 4300

Patent

active

049089331

ABSTRACT:
A method of manufacturing a substrate for mounting electronic components according to this invention comprises the steps of forming a mask on a portion to be electrically connected to an exterior of a lead frame, of forming resin layers on both side surfaces of the lead frame by prepregs or the like, of removing the resin layer on the mask, and of removing the mask, and in the substrate for mounting electronic components manufactured according to this method, the substrate is integrally formed with the lead frame, and the electrical connection of the substrate to the lead frame is performed by through hole plating without using fine metal wiring.

REFERENCES:
patent: 3471348 (1969-10-01), Shaheen
patent: 4052787 (1977-10-01), Shaheen

Affiliated with

Also associated with

Rating

Method of manufacturing a substrate for mounting electronic comp does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a substrate for mounting electronic comp, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a substrate for mounting electronic comp will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-783393