Method of manufacturing a substrate for a microelectronic...

Details Method of manufacturing a substrate for a microelectronic... Method of manufacturing a substrate for a microelectronic...

2011-03-22

2011-03-22

Van, Luan V (Department: 1724)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Treating substrate prior to coating

C205S183000

Reexamination Certificate

active

07909977

ABSTRACT:
A method of manufacturing a substrate for a microelectronic device comprises providing a dielectric material (120, 220, 920) as a build-up layer of the substrate, applying a primer (140, 240, 940) to a surface (121, 221, 921) of the dielectric material, and forming an electrically conductive layer (150, 250, 950) over the primer. In another embodiment, the method comprises providing the dielectric material, forming the feature extending into the dielectric material, forming the electrically conductive layer over the dielectric material, applying the primer to a surface of the electrically conductive layer and attaching a dielectric layer (960) to the primer.

REFERENCES:
patent: 4808274 (1989-02-01), Nguyen
patent: 4897338 (1990-01-01), Spicciati et al.
patent: 5108553 (1992-04-01), Foster et al.
patent: 6085414 (2000-07-01), Swarbrick et al.
patent: 2007/0163887 (2007-07-01), Hofmann
patent: 2009/120967 (2009-10-01), None
patent: 2009/120967 (2010-04-01), None

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