Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1987-07-09
1989-05-16
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 58, B05D 512
Patent
active
048308781
ABSTRACT:
A method of manufacturing a substrate coated with a plurality of thick films wherein conductive layers are wholly prepared from conductive paste, and also a device comprising the substrate. The present invention offers the advantages that the drawbacks accompanying the conventional conductor of silver-palladium base are overcome by forming a resistor having a required resistivity and a high reproducibility. A conductive paste and insulative paste are fired at a lower temperature than that at which the resistor paste is fired, without reducing the adhesion strength of the conductive layer to the substrate. A low temperature melting point crystalline composition is used as an insulative layer to ensure that the resistance of the resistor is not adversely affected by repeated firings.
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patent: 4415607 (1983-11-01), Denes
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patent: 4503090 (1985-03-01), Brown
patent: 4632845 (1986-12-01), Obstfelder
E. K. Browne and B. Walton, "An Ai.sub.2 Firing Base Metal Resistor and Conductor System for Low Cost Thick Film Circuit Manufacture", Electrocomponent Science and Technology, vol. 81, 1981, pp. 61-65.
K. W. Allison and J. D. Provance "Performance of Mixed-Bonded Thick-Film Conductors After Multiple Firing", Electronic Production, Oct. 1979, pp. 71-91.
DuPont's Mydas System "DuPont Offers a New High-Yield High Performance, Thick Film Materials and Processing System".
Masao Segawa, Yoshimi Twasaki and Tsuneo Kaneko, "Large-Size Hybrid ICS for Portable VTRS", IMC 1984 Proceedings, Tokyo, May 21-23, 1984.
Ezaki Shiro
Kaneko Tsuneo
Beck Shrive
Dang Vi Duong
Kabushiki Kaisha Toshiba
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