Method of manufacturing a structure body bonding with a...

Metal working – Method of mechanical manufacture – Fluid pattern dispersing device making – e.g. – ink jet

Reexamination Certificate

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Details

C029S611000, C029S830000, C029S831000, C029S832000, C217S027000

Reexamination Certificate

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10978928

ABSTRACT:
Provided is technology capable of avoiding complex processes and high costs while securing the protection of the functional unit upon forming a device including a glass substrate. A manufacturing method of a structural body structured with a bonding body formed from a glass substrate and a semiconductor substrate, including a first step of forming a first functional unit as a structural element of the structural body on one face of the glass substrate; a second step of bonding the semiconductor substrate to one face of the glass substrate so as to cover the first functional unit; a third step of forming an affected zone extending in the thickness direction of the glass substrate by irradiating a laser beam from the other face side of the glass substrate and scanning the focal point of the laser beam in the thickness direction of the glass substrate; and a fourth step of forming a hole in the glass substrate by etching the glass substrate and removing the portion along the affected zone.

REFERENCES:
patent: 3917495 (1975-11-01), Horn
patent: 4814856 (1989-03-01), Kurtz et al.
patent: 5002901 (1991-03-01), Kurtz et al.
patent: 5940957 (1999-08-01), Goto et al.
patent: 6113218 (2000-09-01), Atobe et al.
patent: 09-309744 (1997-12-01), None
patent: 10/193611 (1998-07-01), None
patent: 2000-186931 (2000-07-01), None
patent: 2002-172776 (2002-06-01), None
patent: 2003-154652 (2003-05-01), None
patent: 2003-182071 (2003-07-01), None
patent: 2003-231251 (2003-08-01), None
patent: 2003-254970 (2003-09-01), None
patent: 2003-287537 (2003-10-01), None
patent: 2004-003950 (2004-01-01), None
patent: 2004-061239 (2004-02-01), None
patent: 2004-066506 (2004-03-01), None
patent: 2004-077372 (2004-03-01), None
patent: 2004-101218 (2004-04-01), None
Masuda et al “Fabrication of microreactor structures three-dimensionally embedded in glass by femtosecond laser” 2002 and its partial English translation.
Communication from Japanese Patent Office regarding corresponding application with translation, no date.
Communication from Japanese Patent Office re: related application, no date.

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