Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal
Reexamination Certificate
2005-11-14
2008-08-19
Lindsay, Jr., Walter (Department: 2812)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
C438S106000, C438S118000, C257SE31001
Reexamination Certificate
active
07413919
ABSTRACT:
Methods of manufacturing a diagnostic layer containing an array of sensing elements. The sensing elements, associated wires, and any accompanying circuit elements, are incorporated various layers of a thin, flexible substrate. This substrate can then be affixed to a structure so that the array of sensing elements can analyze the structure in accordance with structural health monitoring techniques. The substrate can also be designed to be incorporated into the body of the structure itself, such as in the case of composite structures.
REFERENCES:
patent: 3713127 (1973-01-01), Keledy et al.
patent: 3822586 (1974-07-01), Pollock
patent: 3858439 (1975-01-01), Nakamura
patent: 3924456 (1975-12-01), Vahaviolos
patent: 3956731 (1976-05-01), Lewis, Jr.
patent: 4006625 (1977-02-01), Davis
patent: 4107981 (1978-08-01), Kanagawa et al.
patent: 5176032 (1993-01-01), Holroyd et al.
patent: 5195046 (1993-03-01), Gerardi et al.
patent: 5298964 (1994-03-01), Nelson et al.
patent: 5714687 (1998-02-01), Dunegan
patent: 5774376 (1998-06-01), Manning
patent: 5814729 (1998-09-01), Wu et al.
patent: 6006163 (1999-12-01), L'ichtenwalner et al.
patent: 6065342 (2000-05-01), Kerr et al.
patent: 6170334 (2001-01-01), Paulson
patent: 6252334 (2001-06-01), Nye et al.
patent: 6370964 (2002-04-01), Chang et al.
patent: 6399939 (2002-06-01), Sundaresan et al.
patent: 6418384 (2002-07-01), Rothea et al.
patent: 6529127 (2003-03-01), Townsend et al.
patent: 6691007 (2004-02-01), Haugse et al.
patent: 6693548 (2004-02-01), Boyce et al.
patent: 6768312 (2004-07-01), Sun et al.
patent: 6826982 (2004-12-01), O'Brien et al.
patent: 6964201 (2005-11-01), Xu et al.
patent: 7038470 (2006-05-01), Johnson
patent: 7075424 (2006-07-01), Sundaresan
patent: 7103507 (2006-09-01), Gorinevsky
patent: 7117742 (2006-10-01), Kim
patent: 7118990 (2006-10-01), Xu et al.
patent: 7201035 (2007-04-01), Sunshine
patent: 7246521 (2007-07-01), Kim
patent: 2001/0047691 (2001-12-01), Dzenis
patent: 2002/0154029 (2002-10-01), Watters et al.
patent: 2003/0164700 (2003-09-01), Goldfine et al.
patent: 2004/0002815 (2004-01-01), Ishizak et al.
patent: 2004/0032013 (2004-02-01), Cobbley et al.
patent: 2004/0163478 (2004-08-01), Xu et al.
patent: 2005/0072249 (2005-04-01), Maeda et al.
patent: 2006/0079747 (2006-04-01), Beard et al.
patent: 2006/0149449 (2006-07-01), Baur et al.
patent: 2006/0154398 (2006-07-01), Qing et al.
patent: 2006/0179949 (2006-08-01), Kim
patent: 2006/0283266 (2006-12-01), Qing et al.
patent: 2007/0018083 (2007-01-01), Kumar et al.
patent: 4237404 (1994-05-01), None
patent: 19835561 (2000-02-01), None
patent: 10217031 (2003-10-01), None
Roh, Youn-Seo, et al., “Effect of Impact Damage on Lamb Wave Propagation in Laminated Composites” Department of Aeronautics and Astronautics, Stanford University, Stanford, CA 94305 (1995) pp. 1-12.
Keilers, Charles Henry Jr., “Damage identification in Composites Using Built-in Piezoelectrics: A Dissertation Submitted to the Department of Aeronautics and Astronautics and the Committee on Graduate Studies of Stanford University in Partial Fulfillment of the Requirements for the Degree of Doctor of Philosophy”, pp. 1-111 (Jun. 1993).
Roh, Youn-Seo, “Built-in Diagnostics for Identifying an Anomaly in Plates Using Wave Scattering”, UMI Microform 9924496, UMI Company, ANn Arbor, MI (1999) pp. iv-88.
Chang, Fu-Kuo, “Built-in Damage Diagnostics for Composite Structures” Department of Aeronautics and Astronautics, Stanford University, Stanford, CA 94305 (1995).
Chang Fu-Kuo
Qing Xinlin
Acellent Technologies, Inc.
Lindsay, Jr. Walter
MacPherson Kwok & Chen & Heid LLP
Mustapha Abdulfattah
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