Method of manufacturing a stress-free heatsink assembly

Metal working – Method of mechanical manufacture – Heat exchanger or boiler making

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Details

29505, 165185, B23P 1526

Patent

active

055355153

ABSTRACT:
A stress-free heatsink assembly and method of manufacturing the same with wire elements embedded into a cured, flexible support element without a rigid base is provided. The heads of the wire elements are embedded in the support element with the enlarged contact surface being in close proximity to and coplanar with the lower surface of the support element. The heatsink assembly adapts to the contour and surface of the heat source as the heat source thermally expands and contracts. Each of the wire elements move independently of one another to adapt to the changing heat source surface to ensure excellent contact of the heat dissipating wire elements to the surface of the heat source at all times. In the manufacture of the stress-free heatsink assembly, the wire elements are introduced into a die member with the heads exposed, a curable media is then placed on top of the heads of the wire elements. A pressure plate provides force to curable media to extrude out excess media on the heads. The media is then cured and can be then removed from the surface of the die with wire elements embedded therein. The stress-free heatsink assembly permits the employment of wire elements of varying size, configuration, array, and material composition. The heatsink assembly may be easily cut to size in accordance with design specifications.

REFERENCES:
patent: 3327779 (1967-06-01), Jacoby
patent: 4022272 (1977-05-01), Miller
patent: 4491557 (1985-01-01), Breitmoser et al.
patent: 4709374 (1987-11-01), Jacoby
patent: 4733453 (1988-03-01), Jacoby
patent: 5014776 (1991-05-01), Hess
patent: 5224538 (1993-07-01), Jacoby
patent: 5247734 (1993-09-01), Lubbe et al.
patent: 5406698 (1995-04-01), Lipinski
patent: 5499450 (1996-03-01), Jacoby

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