Method of manufacturing a stacked die module

Details Method of manufacturing a stacked die module Method of manufacturing a stacked die module

2011-03-22

2011-03-22

Smith, Matthew S (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S113000, C438S127000, C257SE21501, C257SE21503

Reexamination Certificate

active

07910404

ABSTRACT:
A method of manufacturing a stacked die module includes applying a plurality of stacked die structures to a carrier. Each stacked die structure includes a first semiconductor die applied to the carrier and a second semiconductor die stacked over the first semiconductor die. The second semiconductor die has a larger lateral surface area than the first semiconductor die. A dam is applied around each of the stacked die structures, thereby forming an enclosed cavity for each of the stacked die structures. The enclosed cavity for each stacked die structure surrounds the first semiconductor die of the stacked die structure.

REFERENCES:
patent: 4824006 (1989-04-01), Shimizu
patent: 6309911 (2001-10-01), Hyoudo et al.
patent: 6340846 (2002-01-01), LoBianco et al.
patent: 6492726 (2002-12-01), Quek et al.
patent: 7022549 (2006-04-01), Hedler et al.
patent: 7091595 (2006-08-01), Fuergut et al.
patent: 7208345 (2007-04-01), Meyer et al.
patent: 7274110 (2007-09-01), Meyer et al.
patent: 7326592 (2008-02-01), Meyer et al.
patent: 2004/0166238 (2004-08-01), Nowicki et al.
patent: 2006/0197187 (2006-09-01), Lohninger et al.
patent: 2007/0152345 (2007-07-01), Wu et al.
patent: 2008/0105966 (2008-05-01), Beer et al.
M. Brunnbauer et al., “Embedded Wafer Level Ball Grid Array (eWLB)”; Electronics Packaging Technology Conference, IEEE; pp. 1-5; © 2006.
J. Fjelstad, Verdant Electronics article entitled “Integrating IC Packages and Substrates for Improved Assembly Cost and Reliability”; 56 pgs; Nov. 8, 2007.
Asymtek webpage entitled “Dam & Fill Dispensing”; available at http://www.asymtek.com/Applications/dam—fill.htm; 1 pg.; © 2008.
Asymtek webpage entitled “DJ-9000 DispenseJet Valve—Speed, Flexibility, Process Control, Experience”; available at http://www.asymtek.com/products/dj—9000—jetting.htm; 2 pgs.; © 2008.
Article entitled “Commercial Applications of Digital Printing Technologies on PCBs”; 9 pgs; undated.
DELO Industrie Klebstoffe GMBH & Co. webpage entitled “Smart Card / Smart Label”; available at http://www.delo.de/index.php?level=2&id=3&leaf=33&lang=en; 1 pg.; undated.

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