Method of manufacturing a solid-state image pickup device

Details Method of manufacturing a solid-state image pickup device Method of manufacturing a solid-state image pickup device

1984-08-22

1986-09-02

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29578, 29577C, 29589, 29571, 148 15, 148DIG172, 148DIG75, 357 24, 357 30, 357 31, H01L 2714

Patent

active

046087494

ABSTRACT:
A method of manufacturing a "two-level" solid-state image pickup device wherein a portion of a first metallic electrode electrically connected to a signal storage region is made to project to the highest position above a substrate on which it is formed. A coating of an organic insulating film is then applied to produce a flat surface. The entire surface of the organic film is then etched to expose the projections of the first metallic electrode. A second metallic electrode constituting a pixel electrode is connected to the first electrode at the exposed portion thereof.

REFERENCES:
patent: 3777061 (1973-12-01), Takemura
patent: 4127877 (1978-11-01), Morishita et al.
patent: 4245164 (1981-01-01), Funashashi
patent: 4360821 (1982-11-01), Tsukada et al.
patent: 4363963 (1982-12-01), Ando
patent: 4405935 (1983-09-01), Bowi et al.
patent: 4498013 (1985-02-01), Kuroda et al.
patent: 4517733 (1985-05-01), Hamano

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